Add TFM support for stm32l562e_dk board #31118

yestin · 2021-01-06T06:08:13Z

This PR is to add the TF-M support for the stm32l562e_dk board.

boards/arm/stm32l562e_dk/stm32l562e_dk_ns.dts

erwango · 2021-01-06T08:44:34Z

samples/tfm_integration/tfm_ipc/boards/stm32l562e_dk_ns.overlay

+ * - TFM_PSA_API=ON (IPC)
+ * - ISOLATION_LEVEL 2
+ * - TEST_S=ON (REGRESSION)
+ * - TEST_NS=ON (REGRESSION)


After some more search, it seems that this is not the case anymore (#30210), at least this sample doesn't require TEST_NS to be enabled.

It might be worth checking potential impacts on partitions sizes.

I see. And yes, the non secure image in this sample is pretty small, like 19KB. I can try to decrease the non secure image size, but may still not enough for the secondary partitions.

I was just looking at this PR, and indeed with 512 KB flash it will be a bit of a juggling-act to try to make this work with the dual-bank bootloader. It's possible, but more complex projects will be a challenge without using a different approach for the secure bootloader.

In the new patch, I leave the partition layout as is except updated the comments. As the secure image is almost 224 KB, it could not fit a secondary partition in 512 KB flash.

ioannisg

porting looks fine to me, and along the lines of the other tf-m capable platforms.
needs formal approval from @erwango

galak · 2021-02-16T23:14:47Z

@yestin do you mind rebasing this to address the merge conflict.

ioannisg · 2021-02-22T09:06:28Z

@yestin may i kindly ask you to do one more rebase of this PR? I recently merged #32044 which centralizes the signing for TFM builds, so you do not need to duplicate this any more in the board definition. Please, take a look at the other TFM-capable boards, for guidance.

After this rebase, assuming I get a +1 from @microbuilder , I'll merge this PR.

yestin · 2021-02-24T06:55:42Z

@yestin may i kindly ask you to do one more rebase of this PR? I recently merged #32044 which centralizes the signing for TFM builds, so you do not need to duplicate this any more in the board definition. Please, take a look at the other TFM-capable boards, for guidance.

After this rebase, assuming I get a +1 from @microbuilder , I'll merge this PR.

Yes, I will look into rebasing on top of the new changes. I am running into issue that the signing generates .hex file instead .bin file with the new merge. The TFM_UPDATE.sh script calls STM32_Programmer_CLI to flash, and when the download file is hex file, it does not honor the downloading address that passed in.

The .hex file for NS image still links against the start address at 0x08000000, which is not a correct start address in secure state. For stm32l552xx and stm32l562xx, the flash memory space is aliased to 0x0C000000 in secure state (TZEN=1). I still need some time to debug this.

This commit allows to append an optional --hex-addr argument to the wrapper script if speficied. This can adjust the base address of the output hex file when signing the non-secure or secure firmware images. Signed-off-by: Yestin Sun <[email protected]>

This commit adds a second target for the stm32l562e_dk board. The non secure target can be configured for TFM IPC application. Signed-off-by: Yestin Sun <[email protected]>

After TZ is enabled, the GPIO peripherals are secured and are not accessible from non secure world. This commit prevents the GPIO pinctrl from the non secure target for stm32l562e_dk board. Signed-off-by: Yestin Sun <[email protected]>

This commit enables the TF-M IPC sample application on stm32l562e_dk board. It provides device tree flash partition as an overlay in order to configure and flash the bl2, secure/non secure firmwares. Signed-off-by: Yestin Sun <[email protected]>

This commit removes the signing commands from the post build steps, in order to leverage the consolidated TFM signing code. Also with the support to adjust the hex base address when signing, there is no need to run the TFM_UPDATE.sh script. We can use west flash to flash the merged hex file on the board. Signed-off-by: Yestin Sun <[email protected]>

yestin · 2021-02-27T02:54:40Z

@ioannisg @microbuilder the rebased changes are ready for review. I add an option to the signing script to adjust the hex base address. This can allow the output hex file to be flashed to a different address. In the case for nucleo_l552ze_q and stm32l562e_dk boards, they have a different flash memory space (0x0C000000) when TZ is enabled.

I also update the nucleo_l552ze_q board to leverage the centralized signing code. cc: @erwango

yestin · 2021-03-18T04:03:25Z

@ioannisg do you get a chance to review the PR? It has been pending for some time and I am worried I would have to rebase it again. Please let me know if you have concerns.

ioannisg · 2021-03-18T09:30:48Z

@ioannisg do you get a chance to review the PR? It has been pending for some time and I am worried I would have to rebase it again. Please let me know if you have concerns.

@yestin apologies for forgetting this PR, for some time. To clarify, the reason for adding DNM flag is that i was not able to run the tfm_ipc test properly, on the STM32L562 board, using the PR, so needed to investigate this more.

@yestin are you able to successfully compile, flash and run the tfm_ipc sample on this board and on nucleo_l552ze_q?

erwango · 2021-03-18T10:28:56Z

boards/arm/nucleo_l552ze_q/doc/nucleol552ze_q.rst

+using the ``nucleo_l552ze_q_ns`` target. When building a ``*_ns`` image with TF-M,
+a ``build/tfm/install/postbuild.sh`` bash script will be run as a post-build step
+to make some required flash layout changes. The ``build/tfm/regression.sh`` script
+will need to be run to perform device initialization, and then run ``west flash --hex-file build/tfm_merged.hex``


Can you review the command here?
I had to go in samples/tfm_integration/tfm_ipc/build and then launch west flash --hex-file tfm_merged.hex

Yes, this needs an improvement.

Looks like the build output is generated to the sample project directory instead of the root directory. I did a clean run and can see the merged hex file is generated at build/tfm_merged.hex. Do you have any local environments that may impact?

@yestin the file is present here indeed, though, when running the command, I'm getting the following west error:

$ west flash --hex-file build/stm32l562e_dk_ns/tfm_merged.hex FATAL ERROR: --build-dir was not given, /local/mcu/zephyrproject/zephyr/samples/tfm_integration/tfm_ipc is not a build directory and the default build directory cannot be determined. Check your build.dir-fmt configuration option

@ioannisg is that what you're seeing as well ?

@yestin I confirm this is only due to my local build.dir-fmt configuration.
I've raised #33498 to discuss it

erwango

Approved, I'll review the doc part once merged.

ioannisg · 2021-03-18T13:09:02Z

boards/arm/stm32l562e_dk/stm32l562e_dk_ns_defconfig

+CONFIG_UART_CONSOLE=y
+
+# Enable MPU
+CONFIG_ARM_MPU=y


We should probably enable HW_STACK_PROTECTION=y here as well. Or is there a problem with this @yestin @erwango ?

yestin · 2021-03-19T05:26:58Z

@ioannisg do you get a chance to review the PR? It has been pending for some time and I am worried I would have to rebase it again. Please let me know if you have concerns.

@yestin apologies for forgetting this PR, for some time. To clarify, the reason for adding DNM flag is that i was not able to run the tfm_ipc test properly, on the STM32L562 board, using the PR, so needed to investigate this more.

@yestin are you able to successfully compile, flash and run the tfm_ipc sample on this board and on nucleo_l552ze_q?

Yes, I verify that I can run the tfm_ipc sample on both boards.

yestin requested review from galak, ioannisg, MaureenHelm, microbuilder and nashif as code owners January 6, 2021 06:08

github-actions bot added area: Boards area: Devicetree area: Documentation area: Modules area: Samples Samples platform: STM32 ST Micro STM32 labels Jan 6, 2021

yestin commented Jan 6, 2021

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boards/arm/stm32l562e_dk/stm32l562e_dk_ns.dts Outdated Show resolved Hide resolved

erwango reviewed Jan 6, 2021

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erwango mentioned this pull request Jan 8, 2021

drivers/serial: stm32: Force oversampling value #31178

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zephyrbot added the area: TF-M ARM Trusted Firmware-M (TF-M) label Jan 8, 2021

zephyrbot assigned microbuilder Jan 8, 2021

yestin force-pushed the stm32l562e-tfm-support branch from 3d7ea4c to 9ecb9c9 Compare January 13, 2021 06:17

ioannisg approved these changes Jan 23, 2021

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erwango approved these changes Feb 15, 2021

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yestin force-pushed the stm32l562e-tfm-support branch 2 times, most recently from 0362171 to 687f0b5 Compare February 22, 2021 02:33

yestin added 5 commits February 26, 2021 16:11

boards: stm32l562e_dk: Add non secure target

883394f

This commit adds a second target for the stm32l562e_dk board. The non secure target can be configured for TFM IPC application. Signed-off-by: Yestin Sun <[email protected]>

yestin force-pushed the stm32l562e-tfm-support branch from 687f0b5 to da58bd0 Compare February 27, 2021 00:41

yestin requested review from ABOSTM and FRASTM as code owners February 27, 2021 00:41

yestin requested review from ioannisg and erwango February 27, 2021 02:49

erwango approved these changes Mar 5, 2021

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ioannisg added the DNM This PR should not be merged (Do Not Merge) label Mar 5, 2021

erwango requested changes Mar 18, 2021

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erwango approved these changes Mar 18, 2021

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ioannisg removed the DNM This PR should not be merged (Do Not Merge) label Mar 18, 2021

ioannisg reviewed Mar 18, 2021

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microbuilder approved these changes Mar 18, 2021

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ioannisg merged commit 93ff119 into zephyrproject-rtos:master Mar 18, 2021

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Add TFM support for stm32l562e_dk board #31118

Add TFM support for stm32l562e_dk board #31118

yestin commented Jan 6, 2021

erwango Jan 6, 2021 •

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yestin commented Mar 19, 2021

Add TFM support for stm32l562e_dk board #31118

Add TFM support for stm32l562e_dk board #31118

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yestin commented Jan 6, 2021

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yestin commented Mar 19, 2021

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